Chips & Wafers@ChipsandWafers
Jul 4
1 tweets
#HanmiSemiconductor extends their #HBM TCB capabilities to meet the needs of 16-high #HBM4.
"The TC Bonder 4 equipment is expected to be the preferred choice of global HBM manufacturers as it can lower the purchase price compared to fluxless and hybrid bonders"
This is a problem for #ASMPT $BESI and $KLIC who have been touting their Fluxless TCB and #HybridBonding solutions.
zdnet.co.kr/view/?no=20250
Chips & Wafers
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